Modeling of irregular boron diffusion profiles over varied surface topologies

R. Rumpf, K. Suzuki
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Abstract

Summary form only given. Recently, several different MEMS (Micro Electro Mechanical Systems) devices, which were designed for use in inkjet printers, capacitive pressure sensors, drug delivery devices, chemical reactors, and other similar applications, have included narrow gaps and small holes. We have found a novel technique to fabricate narrow gaps or small holes based on the high boron diffusion etch stop technique. This technique utilizes a boron diffusion anomaly in a narrow space. Such an anomaly has not been reported before and the fabricated structures are very different to what would be expected. In addition, the data from the investigation of these structures serve to point out some interesting new assumptions and suggest a mechanism and method to simulate boron diffusion profiles over a variety of surfaces. This paper describes this new boron diffusion simulator that can predict boron diffusion profiles and details the success of the simulations.
不同表面拓扑结构上不规则硼扩散曲线的建模
只提供摘要形式。最近,设计用于喷墨打印机、电容式压力传感器、药物输送装置、化学反应器和其他类似应用的几种不同的MEMS(微机电系统)设备包括窄间隙和小孔。我们发现了一种基于高硼扩散蚀刻停止技术制造窄间隙或小孔的新技术。该技术利用狭窄空间中的硼扩散异常。这种异常以前没有报道过,而且制造的结构与预期的非常不同。此外,这些结构的研究数据有助于指出一些有趣的新假设,并提出了一种模拟硼在各种表面上扩散曲线的机制和方法。本文介绍了一种能够预测硼扩散曲线的新型硼扩散模拟器,并详细介绍了模拟的成功情况。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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