Gold and Copper Ball Bond Shear Stress Comparison At Different Shear Tool Heights

Abstract

The reliability of wire bond is very significant due to its function of providing interconnection and signal passage to the integrated circuit. Wire bond shear test are utilized to evaluate the reliability and bond strength of bonded wires. In this study, the wire bond shear test is simulated. The effects of shear tool height on the stress response of bonded wires are examined through simulation. Ansys version 11 was utilized for the simulation. The stress response of two wire materials, gold(Au) and copper(Cu) at varied shear tool height during the wire bond shear test were evaluated.A 3D non-linear finite element model was developed for the simulation. The shear tool height of 0.29μm and 8.71μm were employed in this study.The simulation results shows that shear tool height has a significant effects on the stress response of bonded wires.