Nature of the Ag-Si interface in screen-printed contacts: a detailed transmission electron microscopy study of cross-sectional structures

C. Ballif, D.M. Huijic, A. Hessler-Wyser, G. Willeke
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引用次数: 29

Abstract

As screen printed contacts are the predominant metallisation technique in industrial production of Si solar cells, a better understanding of their properties is necessary. In this work, we show that high-quality cross-sectional samples can be prepared, whose study by transmission electron microscopy (TEM) reveals precisely the structure of the contact between the silver fingers and the Si. On diffused [100] Si wafers, direct firing of an Ag paste results in interfaces which are mainly composed of shaped Ag crystallites penetrating the emitter up to 120 nm. These crystallites are in epitaxial relation with the Si substrate. When firing the contacts through a SiN/sub x/ layer, larger Ag crystallites are present at the interface with Si and the orientation relation is lost. In both cases, high resolution TEM imaging and EDX analyses reveal a crystalline Ag/Si interface, where neither oxide nor glass frit can be detected. The presence of a significant glass frit layer between the Ag crystallites contacting the Si and the large Ag grains forming the bulk of the fingers can partly explain why lowly doped emitters are difficult to contact by screen-printing.
丝网印刷接触中Ag-Si界面的性质:横截面结构的详细透射电子显微镜研究
由于丝网印刷触点是硅太阳能电池工业生产中主要的金属化技术,因此更好地了解其性质是必要的。在这项工作中,我们表明可以制备高质量的横截面样品,其透射电子显微镜(TEM)研究精确地揭示了银指与Si之间接触的结构。在扩散[100]硅晶片上,直接烧制银浆料会产生主要由形状银晶组成的界面,该界面可穿透发射极达120 nm。这些晶体与硅衬底呈外延关系。当通过SiN/sub x/层烧制触点时,在与Si的界面处存在较大的Ag晶体,取向关系丧失。在这两种情况下,高分辨率的TEM成像和EDX分析显示了一个结晶的Ag/Si界面,其中既没有氧化物也没有玻璃熔块。在接触Si的银晶和形成手指主体的大银晶粒之间存在显著的玻璃熔块层,这可以部分解释为什么低掺杂的发射体很难通过丝网印刷接触到。
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