Modeling the temperature dependence of sheet and contact resistances in SiGe:C HBTs from 4.3 to 423 K

Xiaodi Jin, Christoph Weimer, Yaxin Zhang, M. Schröter
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引用次数: 1

Abstract

The temperature dependence of series resistance components in SiGe:C HBTs was measured from 4.3 to 423 K. A physics-based description as well as various widely used analytical formulations for modeling the temperature dependence of sheet and contact resistances were compared with the measured data. The standard two-parameter power law model only covers a limited temperature range, while three-parameter models exhibit good accuracy over the entire measured temperature range, and a four-parameter physics-based model shows excellent accuracy. This is the first demonstration for modeling the various sheet resistances from 4.3 to 423 K.
在4.3 ~ 423 K范围内模拟SiGe:C hbt中薄片电阻和接触电阻的温度依赖性
在4.3 ~ 423 K范围内测量了SiGe:C hbt串联电阻元件的温度依赖性。基于物理的描述以及各种广泛使用的分析公式,用于模拟板和接触电阻的温度依赖性,并与测量数据进行了比较。标准的双参数幂律模型仅覆盖有限的温度范围,而三参数模型在整个测量温度范围内具有良好的精度,基于物理的四参数模型具有出色的精度。这是第一次演示了从4.3到423 K的各种薄片电阻的建模。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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