The design and operation of TeraHertz sources based on silicon germanium alloys

J. Kolodzey, T. Adam, R. Troeger, P. Lv, S. Ray, G. Looney, A. Rosen, M. Kagan, I. Yassievich
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引用次数: 4

Abstract

During the past few years, vigorous studies have begun on semiconductor devices that generate and detect frequencies from 0.3 - 10 TeraHertz (1000 30 /spl mu/m). Previous THz sources were based on electrical methods using transistor oscillators (to 0.5 THz), diode frequency multipliers (to 2.5 THz), and femtosecond optical pulse switches. Infrared emitters such as the Quantum Cascade Laser in the III-V semiconductors have been difficult to extend to THz frequencies due to reststrahlen absorption by polar phonons. In contrast, Si has lower absorption and devices may be able to operate over a broader THz range than the III-V semiconductors. This report describes the fabrication and characterization of THz sources based on three different design approaches: intersubband transitions in Silicon Germanium quantum wells, resonant state transitions in boron-doped strained SiGe quantum wells, and dopant impurity transitions in doped Si layers.
基于硅锗合金的太赫兹光源的设计与运行
在过去的几年中,对产生和检测0.3 - 10太赫兹(1000 30 /spl mu/m)频率的半导体设备进行了积极的研究。以前的太赫兹源是基于电方法,使用晶体管振荡器(到0.5太赫兹),二极管倍频器(到2.5太赫兹)和飞秒光脉冲开关。由于极性声子的抑制吸收,III-V半导体中的量子级联激光器等红外发射器难以扩展到太赫兹频率。相比之下,硅具有较低的吸收,器件可能能够在比III-V半导体更宽的太赫兹范围内工作。本报告描述了基于三种不同设计方法的太赫兹源的制造和表征:硅锗量子阱中的子带间跃迁,硼掺杂应变SiGe量子阱中的谐振态跃迁,以及掺杂Si层中的掺杂杂质跃迁。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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