Thermal-Aware Preemptive Test Scheduling for Network-on-Chip Based 3D ICs

K. Manna, C. S. Sagar, S. Chattopadhyay, I. Sengupta
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引用次数: 1

Abstract

The recently proposed three-dimensional (3D) integration promises to enhance the system performance. However, it poses several test challenges. Thermal safety of the 3D system is the foremost concern. Testing of the system plays an important role to improve the yield. This work presents a thermal-aware core test scheduling technique in 3D stacked multicore system using Particle Swarm Optimization (PSO) strategy. To improve the solution quality, the basic PSO has been augmented with multiple PSO operations. The proposed strategy has been compared with other the techniques available in the literature. Thermal-safety has been achieved by providing nominal sacrifice in the test time. The experimental results project the improvement over other state-of-the-art strategies.
基于片上网络的3D集成电路热感知抢占式测试调度
最近提出的三维(3D)集成有望提高系统性能。然而,它提出了几个测试挑战。三维系统的热安全性是人们最关心的问题。系统的测试对提高成品率起着重要的作用。提出了一种基于粒子群优化(PSO)策略的三维堆叠多核系统热感知核测试调度技术。为了提高解决方案的质量,在基本粒子群中增加了多个粒子群操作。所提出的策略已与文献中可用的其他技术进行了比较。热安全是通过在测试时间内提供名义牺牲来实现的。实验结果表明,该策略优于其他最先进的策略。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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