Machine Learning Based V-ramp VBD Predictive Model Using OCD-measured Fab Parameters for Early Detection of MOL Reliability Risk

Sungman Rhee, Hyunjin Kim, Sangku Park, T. Uemura, Yuchul Hwang, S. Choo, Jinju Kim, H. Rhee, Shin-Young Chung
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Abstract

In this paper, we propose for the first time a breakdown voltage $(\mathrm{V}_{\text{BD}})$ prediction method using structural parameters measured in-process for early detection of reliability risks in Middle-Of-Line (MOL). $\boldsymbol{\mathrm{V}_{\text{BD}}}$ of the MOL is proportional to the distance of the Gate (PC) to Source/Drain-Contact (CA). Since PC to CA space can be calculated using MOL-related structural parameters at the early stage of the process, we created and validated models predicting V-ramp $\boldsymbol{\mathrm{V}_{\text{BD}}}$ using five fab parameters measured in-process by optical critical dimension scatterometry (OCD). And we compared three modeling methods. The first is the geometrical calculation model (GCM), the second is multiple-linear-regression (MLR) method, and the last is the Multi-Layer Perceptions (MLP) model based on the machine learning (ML). We found the highest predictive consistency $\boldsymbol{\mathrm{R}^{2}0.6}$ in ML method, and it is expected to contribute to the early prediction of MOL V-ramp $\mathrm{V}_{\text{BD}}$ through additional consistency improvements.
基于机器学习的V-ramp VBD预测模型,利用ocd测量晶圆厂参数早期检测MOL可靠性风险
本文首次提出了一种基于过程中测量的结构参数的击穿电压$(\ mathm {V}_{\text{BD}})$预测方法,用于在线中线可靠性风险的早期检测。MOL的$\boldsymbol{\mathrm{V}_{\text{BD}}}$与栅极(PC)到源漏接点(CA)的距离成正比。由于PC到CA空间可以在工艺的早期阶段使用mol相关的结构参数来计算,我们创建并验证了使用光学临界尺寸散射测量(OCD)在工艺中测量的五个晶圆厂参数来预测V-ramp $\boldsymbol{\mathrm{V}_{\text{BD}}}$的模型。并比较了三种建模方法。首先是几何计算模型(GCM),其次是多元线性回归(MLR)方法,最后是基于机器学习(ML)的多层感知(MLP)模型。我们在ML方法中发现了最高的预测一致性$\boldsymbol{\mathrm{R}^{2}0.6}$,并期望通过进一步的一致性改进为MOL V-ramp $\mathrm{V}_{\text{BD}}$的早期预测做出贡献。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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