Hybrid wafer scale interconnection inventing a new technology

Abstract

Describes a monolithic multilayer thin film technology featuring discretionary wiring and a cellular design methodology which borrows heavily from VLSI design/fabrication technology. Referred to herein as Hybrid Wafer Scale Interconnect (HWSI), it preserves in many ways the advantages of monolithic Wafer Scale Integration (WSI), while simultaneously offering higher yield and superior performance typically associated with optimized subassemblies. It is noteworthy that many 'monolithic' WSI systems currently under development utilize the same, or even more discrete subassemblies, than the proposed HWSI technology.<>