Lead zirconate titanate thin films on GaAs for microwave device applications

S. Arscott, R. Miles, S. J. Milne
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引用次数: 2

Abstract

Summary form only given. Bulk Acoustic Wave (BAW) resonant devices based on quartz crystals are widely used in electronic systems at frequencies up to a few tens of MHz. However for operation at higher frequencies the crystal must be made much thinner and consequently-ceases to be mechanically self supporting. Similarly, Surface Acoustic Wave (SAW) device dimensions shrink at high frequencies requiring sub-micron electrode structures for microwave operation. In this paper we describe how the submicron critical dimensionality of acoustic wave devices can be achieved by depositing thin piezo-ceramic films on semiconductor substrates with the subsequent fabrication of BAW devices. The piezoelectric ceramic used in this work is sol-gel derived lead zirconate titanate (PZT) about 0.5 /spl mu/m thick. Films having the composition Pb(Zr/sub 0.53/Ti/sub 0.47/)O/sub 3/, have been prepared on platinized silicon (Pt-Si) and platinized gallium arsenide (Pt-GaAs) substrates using a 1,3-propanediol and a novel 1,1,1-tris(hydroxymethyl)ethane based sol-gel technique. Crystallisation of the PZT films on the Pt-GaAs was achieved by firing the sol-gel coating at 650/spl deg/C for a dwell time of 1 second using rapid thermal processing (RTP) techniques. Films having the required thickness of /spl sim/0.5 /spl mu/m were produced from a single deposition of the precursor sol resulted. Average values of remnant polarisation (P/sub r/) for the Films were 29 /spl mu/C/cm/sup 2/ and 24 /spl mu/C/cm/sup 2/ on Pt-Si and Pt-GaAs respectively, comparing very well with bulk values. Preliminary microwave characterisation performed on PZT/Pt-Si based BAW resonator structures indicates a fundamental parallel resonance at 0.1 GHz, having an unloaded Q of 1100. Higher frequency operation will be obtained when substrate thinning under the active layer has been optimised.
微波器件用砷化镓锆钛酸铅薄膜
只提供摘要形式。基于石英晶体的体声波(BAW)谐振装置广泛应用于频率高达几十兆赫的电子系统中。然而,为了在更高的频率下工作,晶体必须做得更薄,因此不再具有机械上的自我支撑能力。同样,表面声波(SAW)器件尺寸在高频率下收缩,需要亚微米电极结构用于微波操作。在本文中,我们描述了如何通过在半导体衬底上沉积薄压电陶瓷薄膜并随后制造BAW器件来实现声波器件的亚微米临界尺寸。这项工作中使用的压电陶瓷是溶胶-凝胶衍生的锆钛酸铅(PZT),厚度约为0.5 /spl mu/m。采用1,3-丙二醇和新型的1,1,1-三(羟甲基)乙烷溶胶-凝胶技术,在铂化硅(Pt-Si)和铂化砷化镓(Pt-GaAs)衬底上制备了Pb(Zr/sub 0.53/Ti/sub 0.47/)O/sub 3/薄膜。采用快速热处理(RTP)技术,将溶胶-凝胶涂层在650/spl℃下烧制1秒,实现了PZT薄膜在Pt-GaAs上的结晶。前驱体溶胶的单次沉积产生了所需厚度为/spl sim/0.5 /spl mu/m的薄膜。Pt-Si和Pt-GaAs薄膜的残余极化平均值(P/sub r/)分别为29 /spl mu/C/cm/sup 2/和24 /spl mu/C/cm/sup 2/,与体值比较良好。在基于PZT/Pt-Si的BAW谐振器结构上进行的初步微波表征表明,在0.1 GHz处存在基本并行谐振,其卸载Q为1100。当有源层下的衬底减薄得到优化时,将获得更高频率的操作。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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