A DDR3/4 memory link TX supporting 24–40 Ω, 0.8–1.6 V, 0.8–5.0 Gb/s with slew rate control and thin oxide output stages in 22-nm CMOS SOI

M. Kossel, C. Menolfi, T. Toifl, P. Francese, M. Braendli, T. Morf, L. Kull, T. Andersen, Hazar Yueksel
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引用次数: 1

Abstract

A transmitter for data (DQ) lines in a DDR3/4 memory link is presented. The transmitter supports a drive impedance range of 24-40 Ω, operates from a 0.8-1.6 V supply range, and runs between 0.8 and 5.0 Gb/s. The DDR TX includes a clock-feathering-based slew rate control with duty cycle adjustment and uses thin oxide output stages for power saving. The power supply for the thin oxide pull-up protection is provided by an on-chip voltage regulator. Also FFE with 1 postcursor tap and max. 9.5 dB de-emphasis at 40 Ω is included. Results measured with typical DDR settings such as 30 Ω drive impedance and 1.35 V supply show a 1.2-5.8 V/ns slew rate range into a 50 Ω termination, an energy efficiency at 2133 Mb/s of 4.4 pJ/bit and TJ (BER 10-12) of 26 ps. The transmitter is fabricated in 22-nm CMOS SOI and has a size of 132 × 83 μm2.
DDR3/4内存链路TX支持24-40 Ω, 0.8-1.6 V, 0.8-5.0 Gb/s,摆率控制和薄氧化物输出级,22nm CMOS SOI
介绍了一种用于DDR3/4存储链路中数据(DQ)线路的发送器。变送器支持24-40 Ω的驱动阻抗范围,工作在0.8-1.6 V的电源范围内,运行在0.8和5.0 Gb/s之间。DDR TX包括一个基于时钟羽毛的摆率控制与占空比调整,并使用薄氧化物输出级,以节省电力。用于薄氧化物上拉保护的电源由片上电压调节器提供。也FFE与1后光标点击和最大。包括在40 Ω下的9.5 dB减重。在驱动阻抗为30 Ω和电源电压为1.35 V的典型DDR设置下,测量结果表明,在50 Ω端端,转换速率范围为1.2-5.8 V/ns,能量效率为4.4 pJ/bit, TJ (BER 10-12)为26 ps。该发射机采用22 nm CMOS SOI制成,尺寸为132 × 83 μm2。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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