Modeling and Experimental Research of Vibration N Properties of A Multi-Layer Printed Circuit Board

Zainab H. Al-Araji, N. Swaikat, A. Muratov, A. V. Turetsky
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引用次数: 2

Abstract

Radio-electronic modules of modern devices are an assembly of a large number of a printed circuit board (PCBs), placed in a secure mechanical case. Several heavy electronic components mounted on the printed circuit board (PCB). In the process of operation, the unit Many to various types of loads, such as vibrations and shocks. The main contributions of this work are to reduce the designing time and, thereby, to increase efficiency, computer simulation (modeling) widely used. Accuracy of the engineering machine analysis is one of the cornerstone tasks. The article contains information on the modeling of a large-size PCB by simulation in the Creo Elements/Pro 5.0 Environment, with a comparison of the obtained data with the results of the testing of PCBs on the vibration stand. There is proposed the method of the preliminary analysis of PCBs on mechanical characteristics, before their designing.
多层印刷电路板振动特性建模与实验研究
现代设备的无线电电子模块是由大量印刷电路板(pcb)组装而成,放置在一个安全的机械外壳中。几个沉重的电子元件安装在印刷电路板(PCB)上。在运行过程中,机组多次受到各种类型的载荷,如振动和冲击。本工作的主要贡献在于缩短了设计时间,从而提高了效率,计算机仿真(建模)得到了广泛的应用。工程机械分析的准确性是基础任务之一。本文介绍了在Creo Elements/Pro 5.0环境下对大尺寸PCB进行仿真建模,并将得到的数据与PCB在振动台上的测试结果进行了比较。提出了在pcb设计前对其力学特性进行初步分析的方法。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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