Alexander Henlser, D. Wingert, C. Herold, J. Lutz, M. Thoben
{"title":"Thermal impedance spectroscopy of power modules during power cycling","authors":"Alexander Henlser, D. Wingert, C. Herold, J. Lutz, M. Thoben","doi":"10.1109/ISPSD.2011.5890841","DOIUrl":null,"url":null,"abstract":"The presented thermal impedance spectroscopy of power modules simplifies significantly the failure analysis of power modules. It enables online observation of degradation within the cooling path with detailed information about failure mechanisms. The degradation of certain layer within the power module is detected by observation of Zth parameters. Several tests results are compared with analysis of the scanning acoustic microscope.","PeriodicalId":132504,"journal":{"name":"2011 IEEE 23rd International Symposium on Power Semiconductor Devices and ICs","volume":"30 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2011-05-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"14","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2011 IEEE 23rd International Symposium on Power Semiconductor Devices and ICs","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISPSD.2011.5890841","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 14
Abstract
The presented thermal impedance spectroscopy of power modules simplifies significantly the failure analysis of power modules. It enables online observation of degradation within the cooling path with detailed information about failure mechanisms. The degradation of certain layer within the power module is detected by observation of Zth parameters. Several tests results are compared with analysis of the scanning acoustic microscope.