High speed 3D acquisition chip design for robot applications

Byung-Joo Hong, Seung-Hoon Lee, Jun-Dong Cho, Je-Hyuk Ryu
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Abstract

Obtaining automatic 3D profile of object is one of the most important issues in a robot vision system. We adopt one of the signal separation coding methods called hierarchically orthogonal code (HOC) based on structured light in order to obtain robust depth imaging. To realize this algorithm, high-speed image processing is essential. Because this algorithm requires 17 raw-data pictures to get a picture containing depth information. Therefore, this paper introduces a high-speed hardware platform to perform 3D modeling. Firstly, we implement the platform using FPGA to verify the functionality of our design. Then, our design is fabricated using Samsung 0.18 um CMOS technology. For the chip test, FPGA-based testing board was connected with components for image sensing. The results show that it requires 58 ms to generate one 3D image in realtime. This processing time is 14.5 times faster than the same implementation using software.
机器人高速三维采集芯片设计
物体三维轮廓的自动获取是机器人视觉系统的关键问题之一。为了获得鲁棒深度成像,我们采用了一种基于结构光的信号分离编码方法——层次正交编码(HOC)。为了实现该算法,高速图像处理是必不可少的。因为该算法需要17张原始数据图片才能得到一张包含深度信息的图片。因此,本文引入了一个高速的硬件平台来进行三维建模。首先,我们使用FPGA实现了该平台,以验证我们设计的功能。然后,我们的设计是采用三星0.18 um CMOS技术制造的。对于芯片测试,基于fpga的测试板与图像传感元件连接。结果表明,实时生成一幅三维图像需要58毫秒。这种处理时间比使用软件的相同实现快14.5倍。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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