Selecting methods for packing, shipping, and handling of low cost good die

Abstract

Continuing market demands for electronic products, which are both smaller and lighter, while offering more features and greater reliability at less cost are driving manufacturers to evaluate and restructure their product designs and manufacturing processes to obtain increased throughputs coupled with higher yields. Substituting low cost bare die products for much larger, heavier and more expensive packaged IC products (e.g., PLCCs, SOICs, QFPs and the like) is a major move toward an effective response to these market demands. This paper presents the results of industry studies and surveys to set forth in detail the alternative forms of die packing and handling methods available for use. In addition, criteria are offered for selecting one or more methods best suited to each of the specific manufacturing processes being considered for use.