Remote surface roughness scattering in ultrathin-oxide MOSFETs

F. Gámiz, A. Godoy, F. Jiménez-Molinos, P. Cartujo-Cassinello, J. Roldán
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引用次数: 11

Abstract

A model to study the effect of the roughness at the poly-Si/SiO/sub 2/ interface in silicon inversion layers on the electron mobility is obtained. Screening of the resulting perturbation potential by the channel carriers is taken into account, considering Green's functions for metal-oxide-semiconductor (MOS) geometry, i.e. taking into account the finite thickness of the gate oxide. Mobility of electrons is evaluated at room temperature by the Monte Carlo method, taking into account the simultaneous contribution of phonon scattering, SiO/sub 2//Si interface roughness scattering, Coulomb scattering and remote surface roughness scattering. The contribution of excited subbands is considered. The resulting remote surface roughness scattering is shown to be strongly dependent on the oxide thickness, and degrades mobility curves at low inversion charge concentrations. The results obtained show that the effect of this scattering mechanism cannot be ignored when the oxide thickness is below 5 nm, (as in actual devices), even when (as is usual) very high doping concentrations are used.
超薄氧化mosfet的远端表面粗糙度散射
建立了硅反转层中多晶硅/SiO/sub - 2/界面粗糙度对电子迁移率影响的模型。考虑到金属氧化物半导体(MOS)几何的格林函数,即考虑栅极氧化物的有限厚度,通道载流子对由此产生的扰动电位的筛选被考虑在内。在考虑声子散射、SiO/sub 2/ Si界面粗糙度散射、库仑散射和远端表面粗糙度散射的同时,用蒙特卡罗方法计算了电子在室温下的迁移率。考虑了激发子带的贡献。由此产生的远端表面粗糙度散射强烈依赖于氧化物厚度,并且在低倒置电荷浓度下降低迁移率曲线。结果表明,当氧化物厚度小于5nm时(如在实际器件中),即使使用非常高的掺杂浓度(如通常),这种散射机制的影响也不能忽视。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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