A research on power complementary bipolar technology to prevent parasitic operation

J.H. Kim, C.J. Kim, H. Kang, Y. Jang, S. Lim
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Abstract

A 2 /spl mu/m design ruled, High-Densified, and Low-Power-Consuming Bipolar Integrated Circuit process has been developed. The breakdown voltage of the transistor is 15 V and it has a stable current driving capability at high current (about 1 A) due to the low saturation voltage between emitter and collector. NPN Tr. has been fabricated to prevent leakage current and has good Cut-Off frequency (fT=5 GHz) by using a polysilicon emitter. The characteristics of this process is a Double Epi Process to form a high concentrated N+BL in VPNP Tr. (that is the same as in NPN Tr.) which can protect the parasitic Tr. operation like Latch-Up Phenomenon (Ihold=26 mA, Pa-PNP Tr, hFE=4). And it also includes the IIL Device without an additional mask layer. This process is a low voltage, high current power complementary bipolar process that merges a variety of NPN, VPNP, LPNP, SPNP, IIL devices, and a diffusion resistor.
防止寄生运行的功率互补双极技术研究
开发了一种2 /spl mu/m设计规则、高密度、低功耗的双极集成电路工艺。该晶体管的击穿电压为15 V,由于发射极和集电极之间的饱和电压低,在大电流(约1 a)下具有稳定的电流驱动能力。利用多晶硅发射极,制备了具有良好截止频率(fT=5 GHz)的NPN tr。该过程的特点是双Epi过程,在VPNP Tr中形成高浓度的N+BL(与NPN Tr相同),可以保护寄生Tr的闭锁现象(Ihold=26 mA, Pa-PNP Tr, hFE=4)。它还包括没有额外掩码层的IIL设备。该工艺是一种低电压、大电流功率互补双极工艺,融合了各种NPN、VPNP、LPNP、SPNP、IIL器件和扩散电阻。
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