Sanghoon Lee, Cheng-Ying Huang, A. Carter, J. Law, D. Elias, V. Chobpattana, B. Thibeault, W. Mitchell, S. Stemmer, A. Gossard, M. Rodwell
{"title":"High transconductance surface channel In0.53Ga0.47As MOSFETs using MBE source-drain regrowth and surface digital etching","authors":"Sanghoon Lee, Cheng-Ying Huang, A. Carter, J. Law, D. Elias, V. Chobpattana, B. Thibeault, W. Mitchell, S. Stemmer, A. Gossard, M. Rodwell","doi":"10.1109/ICIPRM.2013.6562630","DOIUrl":null,"url":null,"abstract":"We demonstrate In<sub>0.53</sub>Ga<sub>0.47</sub>As surface channel MOSFETs using a gate-last process and MBE source/drain (S/D) regrowth. The structure uses a sacrificial N+ InGaAs channel cap layer between the regrown S/D contact layer and the channel, which is removed in the channel region by a “digital” etch process incorporating UV ozone oxidation and surface stripping in dilute HCl. A device with 65 nm-L<sub>g</sub> and 1.2 nm EOT shows 1.6 mS/μm peak transconductance at V<sub>ds</sub> = 0.5 V and 120 mV/dec SS at V<sub>ds</sub> = 0.05 V, while 535 nm-L<sub>g</sub> devices show 95 mV/dec SS at at V<sub>ds</sub> = 0.1 V.","PeriodicalId":120297,"journal":{"name":"2013 International Conference on Indium Phosphide and Related Materials (IPRM)","volume":"133 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2013-05-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"14","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2013 International Conference on Indium Phosphide and Related Materials (IPRM)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICIPRM.2013.6562630","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 14
Abstract
We demonstrate In0.53Ga0.47As surface channel MOSFETs using a gate-last process and MBE source/drain (S/D) regrowth. The structure uses a sacrificial N+ InGaAs channel cap layer between the regrown S/D contact layer and the channel, which is removed in the channel region by a “digital” etch process incorporating UV ozone oxidation and surface stripping in dilute HCl. A device with 65 nm-Lg and 1.2 nm EOT shows 1.6 mS/μm peak transconductance at Vds = 0.5 V and 120 mV/dec SS at Vds = 0.05 V, while 535 nm-Lg devices show 95 mV/dec SS at at Vds = 0.1 V.