C. Steinbeiser, K. Dinh, A. Chiu, M. Coutant, O. Krutko, M. Tessaro
{"title":"100 Gb/s Optical DP-QPSK Using Two Surface Mount Dual Channel Modulator Drivers","authors":"C. Steinbeiser, K. Dinh, A. Chiu, M. Coutant, O. Krutko, M. Tessaro","doi":"10.1109/CSICS.2012.6340054","DOIUrl":null,"url":null,"abstract":"A dual channel broadband surface mount optical modulator driver has been developed for use in 100Gb/s fiber optic transponders. Each channel is capable of delivering 4 to 8Vpp to each port of the optical modulator at data rates spanning through 43Gb/s with adjustable crossing point and eye quality control. This surface mount package solution enables a more compact system design and use of simple low cost surface mount assembly processes, eliminating the need for expensive connectorized driver and MUX module solutions and eliminating the need for expensive SMPM RF cable interconnects, which are key requirements for next generation 100Gb/s transponders.","PeriodicalId":290079,"journal":{"name":"2012 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS)","volume":"457 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2012-10-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2012 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/CSICS.2012.6340054","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
Abstract
A dual channel broadband surface mount optical modulator driver has been developed for use in 100Gb/s fiber optic transponders. Each channel is capable of delivering 4 to 8Vpp to each port of the optical modulator at data rates spanning through 43Gb/s with adjustable crossing point and eye quality control. This surface mount package solution enables a more compact system design and use of simple low cost surface mount assembly processes, eliminating the need for expensive connectorized driver and MUX module solutions and eliminating the need for expensive SMPM RF cable interconnects, which are key requirements for next generation 100Gb/s transponders.