Design and investigation of 3D microwave devices manufactured under the low-temperature co-fired ceramic process

13th International Crimean Conference Microwave and Telecommunication Technology, 2003. CriMiCo 2003. Pub Date : 1900-01-01 DOI:10.1109/CRMICO.2003.158891

R. Zimin, S.D. Logvinenko, A. A. Kishchinskiy, B. Krylov, N. V. Frolova

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Abstract

This report describes the opportunities presented by the LTCC technology, its implementation and its practical application in the manufacture of 3D microwave devices.

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低温共烧陶瓷工艺下三维微波器件的设计与研究

本报告描述了LTCC技术所带来的机遇，它的实现及其在3D微波器件制造中的实际应用。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

13th International Crimean Conference Microwave and Telecommunication Technology, 2003. CriMiCo 2003.

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