Prop-rammable architectures - Session 19

Proceedings of the IEEE 2004 Custom Integrated Circuits Conference (IEEE Cat. No.04CH37571) Pub Date : 1900-01-01 DOI:10.1109/cicc.2004.1358837

J. Wright

引用次数: 0

Abstract

Structured ASICs consist of a regular array of pre-designed logic elements that can be interconnected as needed to implement a user's circuit. The "programming" of these devices involves fabricating a small number of metal mask or via layers in a silicon foundry. Since most of the mask layers on the chip are the same for all designs, with only the final metal or via layers being customized for a particular circuit, manufacturing time, and risk, is decreased compared to traditional standard cell ASICs. Our first three papers examine design issues for structured ASICs.

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可编程架构-第19部分

结构化asic由预先设计的逻辑元件组成，这些逻辑元件可以根据需要相互连接以实现用户的电路。这些设备的“编程”涉及在硅铸造厂制造少量金属掩膜或通过层。由于芯片上的大多数掩模层对于所有设计都是相同的，只有最终金属层或通孔层是为特定电路定制的，因此与传统的标准单元asic相比，制造时间和风险都降低了。我们的前三篇论文研究了结构化asic的设计问题。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Proceedings of the IEEE 2004 Custom Integrated Circuits Conference (IEEE Cat. No.04CH37571)

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