Effects of Ceramic Ball-Grid-Array Package's Manufacturing Variations on Solder Joint Reliability

Proceedings of the International Conference on Multichip Modules Pub Date : 1994-04-13 DOI:10.1109/ICMCM.1994.753599

T. Ju, Y.C. Lee

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引用次数: 4

Abstract

The effects of manufacturing variations on the reliability of solder joints between a ceramic ball grid array (BGA) package and a printed wiring board (PWB) are investigated. Three manufacturing parameters tinder consideration are 1) solder volume, 2) solder height, and 3) solder pad size. To study the manufacturing effects, a solder joint profile model is derived. Then the maximum strain is calculated, and the fatigue life of the solder joint is predicted. The accuracy of the solder profile model is verified by comparing its predicted profiles with experimental results. The fatigue life of a solder joint is estimated by the Coffin-Manson's relation. The calculations show that the manufacturing variations change the joint profile, and subsequently affect the fatigue life. The solder joints formed may have convex, cylindrical and concave profiles. The concave solder joints are preferred, which have long fatigue lives and are less sensitive to the manufacturing variations. For the convex solder joints, their fatigue lives are strongly affected by the joint height variation and by the combined effects of solder volume and pad size.

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陶瓷球栅阵列封装工艺变化对焊点可靠性的影响

研究了陶瓷球栅阵列(BGA)封装与印刷线路板(PWB)之间焊点可靠性的影响。tinder考虑的三个制造参数是1)焊料体积，2)焊料高度和3)焊料垫尺寸。为了研究焊点的制造效果，建立了焊点轮廓模型。然后计算最大应变，预测焊点的疲劳寿命。通过与实验结果的比较，验证了模型的准确性。用Coffin-Manson关系估计了焊点的疲劳寿命。计算结果表明，制造工艺的变化改变了接头的外形，进而影响了接头的疲劳寿命。所形成的焊点可以具有凸、圆柱和凹轮廓。凹形焊点具有较长的疲劳寿命，对制造变化的敏感性较低。对于凸焊点，其疲劳寿命受焊点高度变化以及焊料体积和焊盘尺寸的共同影响。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Proceedings of the International Conference on Multichip Modules

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