Transient thermal impedance tester for power IC packages

Abstract

A transient thermal impedance tester design and its general capabilities are presented. Transient temperature measurements on several power IC packages are obtained. Transient responses of the package subjected to repetitive pulses and to a complex transient power pulse are presented. Temperature measurements on a test chip are compared with the solution as obtained from transient thermal finite element analysis. The effects of measurement delay time on junction temperature measurement are discussed.<>