Method for system-level signal and power integrity modeling of high-speed electronic packages

Abstract

This paper reported the latest development of the modal decomposition with T-matrix method for accurate and efficient analysis of coupling of multiple vias in finite-sized multilayered parallel-plate structures. A novel boundary modeling method, named the frequency-dependent cylinder layer (FDCL), is proposed to resolve the open problem of boundary modeling associated with modal expansion methods. Moreover, a generalized T matrix model derived by the mode matching technique, is created to characterize the coupling effect for vias penetrating more than one layer in a multilayered structure. Both numerical and experimental verifications are presented to validate the new modeling methods. The above method has been incorporated into the simulation tool developed recently by us.