C. Álvarez, M. L. Aranda, A. Torres-Jácome, W. C. Arriaga, Javier de la Hidalga Wade
{"title":"A set of test structures for the development of a CMOS-MEMS technology","authors":"C. Álvarez, M. L. Aranda, A. Torres-Jácome, W. C. Arriaga, Javier de la Hidalga Wade","doi":"10.1109/ICEEE.2016.7751206","DOIUrl":null,"url":null,"abstract":"In this work, a set of test structures that meets the emerging need for Micro-Electro-Mechanical Systems (MEMS) integration process monitoring and material/device property measurement at the wafer level is presented. The CMOS-MEMS test structures are designed to evaluate and assist the development of an integrated CMOS-MEMS process. The acquired data from the test structures will be useful for identifying the possible electrical and/or mechanical variations on the material properties and devices performance due to the fabrication process.","PeriodicalId":285464,"journal":{"name":"2016 13th International Conference on Electrical Engineering, Computing Science and Automatic Control (CCE)","volume":"18 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2016-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 13th International Conference on Electrical Engineering, Computing Science and Automatic Control (CCE)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICEEE.2016.7751206","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
In this work, a set of test structures that meets the emerging need for Micro-Electro-Mechanical Systems (MEMS) integration process monitoring and material/device property measurement at the wafer level is presented. The CMOS-MEMS test structures are designed to evaluate and assist the development of an integrated CMOS-MEMS process. The acquired data from the test structures will be useful for identifying the possible electrical and/or mechanical variations on the material properties and devices performance due to the fabrication process.