Degradation of dc and pulsed characteristics of InAlN/GaN HEMTs under different proton fluences

I. Rossetto, F. Rampazzo, S. Gerardin, M. Meneghini, M. Bagatin, A. Zanandrea, A. Paccagnella, G. Meneghesso, E. Zanoni, C. Dua, M. Forte-Poisson, R. Aubry, M. Oualli, S. Delage
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引用次数: 1

Abstract

Displacement-damage induced degradation in InAlN/GaN structures is studied for different proton fluences, from 11014 p/cm2 to 41014 p/cm2, at 3MeV. DC analysis reveals that devices experience a VTH positive shift and an increase of the RON, following a linear trend with the proton radiation fluence, as a consequence of the creation of acceptor-like traps. Furthermore an increase of the diode gate current is noticed. Pulsed measurements indicate an increase of the so called “current collapse”, especially when a high gate drain voltage difference is applied, as a consequence of the performances variation in the dynamic max gm, VTH shift and RON.
不同质子效应下InAlN/GaN hemt直流和脉冲特性的退化
在3MeV下,从11014 p/cm2到41014 p/cm2的不同质子影响下,研究了InAlN/GaN结构中位移损伤引起的降解。直流分析表明,由于产生了类似受体的陷阱,器件经历了VTH正位移和RON的增加,这与质子辐射通量呈线性趋势。此外,还注意到二极管栅电流的增加。脉冲测量表明所谓的“电流崩溃”的增加,特别是当施加高栅极漏极电压差时,由于动态最大gm, VTH移位和RON的性能变化。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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