A CMOS power amplifier with 180° hybrid on-chip coupler for 4G applications

Mahima Arrawatia, M. Baghini, G. Kumar
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引用次数: 1

Abstract

This paper presents a CMOS Class AB power amplifier with an on-chip 180° hybrid coupler for 4G applications. Two-stage power amplifier architecture with a combination of low voltage core transistor and high voltage I/O transistors, is designed to achieve the power gain in the 180nm standard CMOS technology. The driver stage has a power gain of 18.5dB and linear output power of 12.9dBm. The power stage has a gain of 13.7dB and P1dB of 24.4dBm. The paper also presents an on-chip 180° hybrid coupler, designed in the same technology, for combining the power generated from individual power amplifiers. The measured results of the coupler show an isolation better than -30dB, S11 better than -20dB and, S21 and S31 equal to -5.4dB, at 2.35GHz. The complete differential power amplifier using the on-chip coupler gives P1dB of 26.4dBm and saturated output power of 27.4dBm. As compared to all the reported on-chip couplers configurations, use of 180° hybrid coupler leads to better load insensitivity as well as improved linearity due to the second harmonic cancellation.
具有180°混合片上耦合器的CMOS功率放大器,用于4G应用
本文提出了一种具有片上180°混合耦合器的CMOS AB类功率放大器,用于4G应用。两级功率放大器架构,结合低压核心晶体管和高压I/O晶体管,设计用于实现180nm标准CMOS技术的功率增益。驱动级的功率增益为18.5dB,线性输出功率为12.9dBm。功率级增益为13.7dB, P1dB为24.4dBm。本文还介绍了一种采用相同技术设计的片上180°混合耦合器,用于组合各个功率放大器产生的功率。测量结果表明,在2.35GHz时,该耦合器的隔离度优于-30dB, S11优于-20dB, S21和S31等于-5.4dB。使用片上耦合器的完整差分功率放大器的P1dB为26.4dBm,饱和输出功率为27.4dBm。与所有已报道的片上耦合器配置相比,使用180°混合耦合器可以获得更好的负载不灵敏度,并且由于二次谐波消除而改善了线性度。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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