{"title":"A recombination model for the low current performance of submicron devices","authors":"R. Lefferts, R. Swan, J. Meindl","doi":"10.1109/ISSCC.1982.1156422","DOIUrl":null,"url":null,"abstract":"This paper will cover a generation-recombination model which describes the influence of metallic precipitates on the current gain, leakage current, and 1/f noise of small geometry transistors. The model predicts an increase in device sensitivity to contamination as geometries are reduced to submicron dimensions.","PeriodicalId":291836,"journal":{"name":"1982 IEEE International Solid-State Circuits Conference. Digest of Technical Papers","volume":"23 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"7","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"1982 IEEE International Solid-State Circuits Conference. Digest of Technical Papers","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISSCC.1982.1156422","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 7
Abstract
This paper will cover a generation-recombination model which describes the influence of metallic precipitates on the current gain, leakage current, and 1/f noise of small geometry transistors. The model predicts an increase in device sensitivity to contamination as geometries are reduced to submicron dimensions.