Complex evaluation of SMT defects

Abstract

Soldering process through reflow ovens is a well repeatable work. Once a thermal profile is establish for an oven and any parameters regarding the assembly process do not change, the results are quite identical for each board passing through the oven. The situation is different when other kinds of board are passed through. The usual solution to solving these parameter changes is to do many trials. But for small and diverse production, that is expensive. We try to solve this problem by creating a self teaching application which can predict the parameters of the process starting from board parameters and previous experience. The primary key of this application is to take correct decisions and build the shell matrix of cause-and-effect. That is the aim of the paper.