3D-MID for Space

Abstract

Space applications demand highly reliable and low weight systems. Three-dimensional moulded interconnect device (3D-MID) processes have the potential to fulfil the requirements by combining the (electronic) packaging with routing and mechanical structure. In this paper 3D-MID technology is reviewed, most promising techniques identified and test vehicles are investigated with the focus on space usage within the ESA Artes 5.1 program.