Silver dendrite-based nanocomposites for current cutting-off fuse

R. Yang, Cheng Yang, Xiaoya Cui, Zhexu Zhang
{"title":"Silver dendrite-based nanocomposites for current cutting-off fuse","authors":"R. Yang, Cheng Yang, Xiaoya Cui, Zhexu Zhang","doi":"10.1109/ICEPT.2015.7236627","DOIUrl":null,"url":null,"abstract":"Microelectronics and micromechanical systems (MEMS) are gaining popularity by virtue of small size, high integration, diverse functionalities, mass production and low cost. However, the existing current cutting-off fuse components can hardly be used in a microelectronics or micromechanical system to realize circuit protection due to their large size and high fusing current. Herein we report a novel current cutting-off fuse component based on printed electrically conductive nanocomposites (ECCs), which are composed of silver microdendrites with fractal morphology as the fusible conductive fillers and the thermosetting resin matrix. The silver paste was pasted between two copper electrodes with controlled space. The current cutting-off performance of the fuses was investigated within different silver fillers, various paste sizes, and diverse electrode spaces. The results show that, the silver dendrite-based paste can be fused at a relative low current due to its abundant nano-sized rims at the edge of the dendrite branches. Furthermore, the minimum fusing current (530 mA) was achieved when the silver flake-based paste was dispensed between two electrodes with distance of 100 μm and width of 30 μm. It is obvious that the fusing current attenuates gradually with the increase of space between two copper electrodes, and the silver paste in large spot size possesses higher fusing current than in small one. The scanning electron microscopy (SEM) analyses suggest that the silver fillers go through the melting and shrinking stages during the fusing process, thus the adjacent silver fillers separate to break the circuit. Considering the low material cost and negligible environmental risk, this novel current cutting-off fuse can provide cost-effective and environmental-friendly protection for MEMS devices.","PeriodicalId":415934,"journal":{"name":"2015 16th International Conference on Electronic Packaging Technology (ICEPT)","volume":"98 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2015-09-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2015 16th International Conference on Electronic Packaging Technology (ICEPT)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICEPT.2015.7236627","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1

Abstract

Microelectronics and micromechanical systems (MEMS) are gaining popularity by virtue of small size, high integration, diverse functionalities, mass production and low cost. However, the existing current cutting-off fuse components can hardly be used in a microelectronics or micromechanical system to realize circuit protection due to their large size and high fusing current. Herein we report a novel current cutting-off fuse component based on printed electrically conductive nanocomposites (ECCs), which are composed of silver microdendrites with fractal morphology as the fusible conductive fillers and the thermosetting resin matrix. The silver paste was pasted between two copper electrodes with controlled space. The current cutting-off performance of the fuses was investigated within different silver fillers, various paste sizes, and diverse electrode spaces. The results show that, the silver dendrite-based paste can be fused at a relative low current due to its abundant nano-sized rims at the edge of the dendrite branches. Furthermore, the minimum fusing current (530 mA) was achieved when the silver flake-based paste was dispensed between two electrodes with distance of 100 μm and width of 30 μm. It is obvious that the fusing current attenuates gradually with the increase of space between two copper electrodes, and the silver paste in large spot size possesses higher fusing current than in small one. The scanning electron microscopy (SEM) analyses suggest that the silver fillers go through the melting and shrinking stages during the fusing process, thus the adjacent silver fillers separate to break the circuit. Considering the low material cost and negligible environmental risk, this novel current cutting-off fuse can provide cost-effective and environmental-friendly protection for MEMS devices.
基于银枝晶的电流切断保险丝纳米复合材料
微电子和微机械系统(MEMS)以其体积小、集成度高、功能多样、可批量生产和成本低等优点而日益受到人们的欢迎。然而,现有的电流切断保险丝元件由于体积大、熔断电流大,难以在微电子或微机械系统中实现电路保护。本文报道了一种基于印刷导电纳米复合材料(ECCs)的新型电流切断保险丝组件,该复合材料由具有分形形貌的银微晶组成,作为易熔导电填料和热固性树脂基体。银膏被粘贴在两个铜电极之间,并控制空间。研究了熔断器在不同银填料、不同浆料尺寸和不同电极间距下的电流切断性能。结果表明,由于银枝晶分支边缘具有丰富的纳米级边缘,因此可以在较低的电流下熔融。在距离为100 μm,宽度为30 μm的两个电极之间涂敷银片基浆料时,熔断电流最小(530 mA)。随着两铜电极间距的增大,熔断电流逐渐衰减,斑点较大的银浆熔断电流高于斑点较小的银浆熔断电流。扫描电镜(SEM)分析表明,在熔合过程中,银填料经历了熔化和收缩阶段,导致相邻的银填料分离,断路。考虑到材料成本低,环境风险可忽略不计,这种新型电流切断保险丝可以为MEMS器件提供经济环保的保护。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信