Exploring Carbon Nanotubes for VLSI Interconnects

Abstract

As a result of a decrease in cross-section, increases have been noted in several thermal and electrical properties of copper interconnects. To mitigate such concerns, new approaches are being considered for new wiring solutions for VLSI technologies. The incorporation of carbon nanotubes (CNTs) in VLSI design to replace existing interconnection material, may be an efficient and cost-effective evolution from current materials. Carbon nanotubes, more specifically multi-walled carbon nanotubes (MWCNT), have been identified as potential alternatives to diminish such concerns. This paper will delineate the shared and differing aspects of each of the CNT structures.