Embedded Tutorial ET2: Volume Diagnosis for Yield Improvement

Wu-Tung Cheng, S. Reddy
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引用次数: 1

Abstract

Process variations in sub-nanometer technologies cause systematic defects in manufactured VLSI devices. Such defects may be process dependent as well as design dependent. This requires identification of root causes for systematic defects to aid device yield ramp up. Volume diagnosis or diagnosing a large volume of manufactured devices is necessary to identify systematic defects. Volume diagnosis requires highly efficient and effective software tools since physical failure analysis of a very large number of failing devices is not practical. Typically volume diagnosis uses two procedures. First, responses from failing devices are analyzed using defect diagnosis tools. Next the results of diagnoses are analyzed using statistical, data mining and machine learning techniques to effectively determine the underlying defect distribution for yield improvement. In this presentation, we will discuss diagnosis procedures and methods for analyzing diagnosis data in a typical software based volume diagnosis flow. We will also briefly discuss topics for future research in volume diagnosis.
嵌入式教程ET2:产量改进的体积诊断
亚纳米技术的工艺变化导致制造的超大规模集成电路器件存在系统性缺陷。这些缺陷可能与工艺有关,也可能与设计有关。这需要识别系统缺陷的根本原因,以帮助器件良率上升。批量诊断或诊断大量制造设备是识别系统缺陷所必需的。体积诊断需要高效有效的软件工具,因为对大量故障设备进行物理故障分析是不切实际的。卷诊断通常使用两个步骤。首先,使用缺陷诊断工具分析故障设备的响应。接下来,使用统计、数据挖掘和机器学习技术对诊断结果进行分析,以有效地确定潜在缺陷分布,从而提高成品率。在本报告中,我们将讨论在典型的基于软件的卷诊断流程中分析诊断数据的诊断程序和方法。我们还将简要讨论体积诊断的未来研究课题。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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