Characterization of low alpha emissivity system on electroplated solder bumps

A. Mistry, S. Lee, C. Enman, B. Carroll, D. Mitchell, V. Mathew, D. Weeks, M. Tucker
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引用次数: 1

Abstract

As attention to System Soft Error Rate (SSER) grows, better semiconductor design guidelines are being created. To protect sensitive transistor nodes from alpha particles emanating from trace amounts of natural occurring radioisotopes, improved shielding materials such as die coat barrier films are being used. In parallel, the demand for lower alpha emissivity materials is growing, such that semiconductor materials suppliers and packaging groups must certify their materials as being of a certain alpha emissive content. To this end, this alpha detection system continues to gain prominence, with detection capabilities down to 0.001 alpha count/cm/sup 2//hour and sample measurement sizes to 1000 square centimeters. This study outlines a method of characterization and determines capability of the continuous gas flow proportional counter.
电镀焊料凸点上低α发射率体系的表征
随着对系统软错误率(SSER)的关注不断增长,人们正在创建更好的半导体设计指南。为了保护敏感的晶体管节点不受微量天然放射性同位素产生的α粒子的影响,正在使用改进的屏蔽材料,如模层屏障膜。与此同时,对低α发射率材料的需求正在增长,因此半导体材料供应商和包装集团必须证明其材料具有一定的α发射含量。为此,该alpha检测系统继续获得突出地位,检测能力低至0.001 alpha计数/cm/sup 2//小时,样品测量尺寸为1000平方厘米。本研究概述了一种表征方法,并确定了连续气体流量比例计数器的性能。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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