The gate-bias influence for ESD characteristic of NMOS

Juan Liu, Hang Fan, Jianguo Li, Lingli Jiang, Bo Zhang
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引用次数: 3

Abstract

The positive and negative gate-bias effect on ESD robustness of NMOS devices are analyzed respectively in this paper. The influence of gate-bias have been simulated by ISE TCAD and discussed. The simulation results indicate that the triggering voltage fell from 10.46V to 7.8V with the negative gate bias changed from 0V to −10V, and reduced from 10.46V to 5.92V with the positive gate bias changed from 0V to 3V. Under appropriate gate bias, the ESD protection devices can obtain lower Vt1 and higher Vt2. It gives benefit of triggering the large-dimension MOS uniformly, which can improve ESD robustness directly.
栅极偏置对NMOS ESD特性的影响
本文分别分析了正负栅极偏压对NMOS器件ESD稳健性的影响。用ISE - TCAD模拟了栅极偏置的影响,并进行了讨论。仿真结果表明,当负栅极偏置从0V变为- 10V时,触发电压从10.46V降至7.8V;当正栅极偏置从0V变为3V时,触发电压从10.46V降至5.92V。在适当的栅极偏置下,ESD保护器件可以获得较低的Vt1和较高的Vt2。它具有均匀触发大尺寸MOS的优点,可以直接提高ESD的鲁棒性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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