Modeling of Polyimide MIM Capacitors for Applications in Planar Monolithic Microwave Integrated Circuits

R. Sanusi, A. Rahim, M. N. Osman, N. Kushairi, A. Rasmi, N. Muhammad, M. Yahya, A. Mat
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Abstract

Polymide metal-insulator-metal (MIM) overlay capacitors for use in monolithic microwave integrated circuits (MMICs) based on high electron mobility transistors (HEMTs) on gallium arsenide substrates are presented. Modeling of the capacitors was performed using a 2-dimensional electromagnetic CAD simulator to obtain Scattering (S-) parameters for different capacitor dimensions for operating frequencies from 0.05 to 8 GHz. The behaviour of the capacitor as a function of operating frequencies is studied by means of Smith chart. The capacitor is finally represented by a proposed equivalent circuit model to describe its overall behavior for planar MMIC simulations.
应用于平面单片微波集成电路的聚酰亚胺MIM电容器建模
基于砷化镓衬底的高电子迁移率晶体管(hemt),提出了用于单片微波集成电路(mmic)的聚酰胺金属-绝缘体-金属(MIM)覆盖电容器。利用二维电磁CAD仿真器对电容进行建模,得到了工作频率在0.05 ~ 8 GHz范围内不同电容尺寸下的散射参数。利用史密斯图研究了电容器随工作频率变化的特性。最后,提出了一个等效电路模型来描述电容器的整体行为,用于平面MMIC仿真。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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