Ultra shallow junctions with high dopant activation and GeO2 interfacial layer for gate dielectric in germanium MOSFETs

G. Thareja, S. Chopra, B. Adams, N. Patil, Y. Ta, P. Porshnev, Y. Kim, S. Moffatt, D. Loftis, R. Brennan, G. Goodman, I. Abdelrehim, K. Saraswat, Y. Nishi
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引用次数: 2

Abstract

For the first time, ultra shallow junctions (xj < 10nm) are demonstrated using Plasma Immersion Ion Implantation for both n-type and p-type dopants in Ge. High electrical activation (>1×1020 cm−3) is achieved for all dopant atoms (P/As/Sb/B) using Laser Thermal Processing. We also show ultrathin (0.6nm), high quality GeO2 interfacial layer for gate dielectric, which provides substrate orientation independent Dit and mobility enhancement for Ge high-k N/P MOSFETs.
锗mosfet栅极介质的高掺杂活化超浅结和GeO2界面层
利用等离子体浸没离子注入技术首次在锗中制备了n型和p型掺杂剂的超浅结(xj < 10nm)。采用激光热处理技术对所有掺杂原子(P/As/Sb/B)实现了高电活化(>1×1020 cm−3)。我们还展示了超薄(0.6nm)、高质量的栅极介电介质的GeO2界面层,它为Ge高k N/P mosfet提供了与衬底方向无关的Dit和迁移率增强。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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