Developments and trends in stacked die CSPs

Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003. Pub Date : 1900-01-01 DOI:10.1109/EPTC.2003.1298711

E. J. Vardaman

引用次数: 1

Abstract

With increased demand for small form factor packages for portable products there has been increased demand for dense packaging. Stacking dice inside the CSP is one solution. This presentation focuses on CSPs with multiple dies stacked inside.

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叠模csp的发展和趋势

随着便携式产品对小尺寸封装需求的增加，对致密封装的需求也在增加。在CSP内堆叠骰子是一种解决方案。本演讲的重点是具有多个晶片堆叠在内部的csp。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003.

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