Advanced methods for silicon device modeling

Umberto Ravaioli
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Abstract

The sustained development of digital electronics has driven for many years the advances of silicon device simulation. However, fundamental simulation issues that must be addressed in modern digital devices are also quite relevant for high frequency applications. Quantum effects must be considered in the simulation of aggressively scaled structures, while thermal effects are particular relevant for power applications. Conventional simulation approaches based on the standard semiconductor equations, although computationally efficient, do not always provide a sufficiently predictive model. More advanced physical approaches rely on an extended Boltzmann equation model that can include explicitly the detailed band structure, nonlinear transport effects, quantum corrections and a self-consistent treatment for self-heating and phonon transport. Such complicated physical models are more easily implemented in particle Monte Carlo simulation.
硅器件建模的先进方法
数字电子学的持续发展推动了硅器件仿真技术多年来的进步。然而,在现代数字设备中必须解决的基本仿真问题也与高频应用非常相关。在大尺度结构的模拟中必须考虑量子效应,而热效应与功率应用特别相关。传统的基于标准半导体方程的模拟方法,虽然计算效率高,但并不总是提供一个充分的预测模型。更先进的物理方法依赖于扩展的玻尔兹曼方程模型,该模型可以明确地包括详细的能带结构,非线性输运效应,量子修正以及自加热和声子输运的自洽处理。这种复杂的物理模型在粒子蒙特卡罗模拟中更容易实现。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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