Thermal analysis and modeling of hybrid power modules

Abstract

In this paper the results of thermal analysis and modeling in a hybrid power module are given. Experimental contribution is based on thermal measurements on the realized hybrid power module using a matrix of flip-chip sensors. Thermal measurements were done at different ambient temperatures and different hybrid module power values. Two-dimensional model includes temperature dependent heat conductance and specific heat and takes into account the geometry of the devices, the material thermal conductivity, different dissipation mechanisms, as well as all the possible ways to transfer the dissipated heat. Both the simulation and experimental results obtained are presented graphically. Finally, the temperature distributions obtained theoretically and experimentally are compared and analyzed.