3D via modeling simplification on multilayer mid-planes

Qian Li, K. Melde, G. Yeh, Hui Wu, Yaochao Yang
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引用次数: 1

Abstract

This paper presents a method to simplify the 3D full-wave simulation of via structures on the multilayer mid-planes. The method splits the full-length via model into small via sections, simulates these sections separately. The final simulation results are obtained by cascading the scattering parameters for the small via sections. The simulation accuracy of the cascaded structure for FEXT is comparable to the accuracy obtained with simulations of the 3D via using full-wave simulations in HFSS for frequencies up to 20GHz for both uniform structures and the structures with discontinuity. The results show a dramatic reduction in simulation time and complexity.
通过在多层中间平面上建模简化3D
本文提出了一种简化多层中平面上通孔结构三维全波模拟的方法。该方法将全长通孔模型分割成小的通孔段,分别对这些小的通孔段进行仿真。通过对小通孔截面的散射参数进行级联,得到了最终的仿真结果。对于均匀结构和不连续结构,级联结构在FEXT中的模拟精度可与在HFSS中使用频率高达20GHz的全波模拟所获得的三维模拟精度相媲美。结果表明,仿真时间和复杂度显著降低。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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