{"title":"Effect of power noise coupling between power via and signal via and its relationship with distance","authors":"Hank Lin, B. Tseng, Jackson Yen","doi":"10.1109/ISEMC.2016.7571606","DOIUrl":null,"url":null,"abstract":"The power switching noise caused by rapid charging and discharging has always been an issue in PDN (Power Delivery Network) design. This noise would not only deteriorate the stability of the power profile, it would also couple to signal transition via if the power via is placed nearby, resulting in deterioration of the overall system signal integrity. Therefore, the relative placement between power via and signal transition via is very important in board design. The relationship between effects of power-signal coupling and distance will be addressed in this paper and will be validated with both simulation results and measurement results from a real-case board design.","PeriodicalId":326016,"journal":{"name":"2016 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"99 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2016-07-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"7","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 IEEE International Symposium on Electromagnetic Compatibility (EMC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISEMC.2016.7571606","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 7
Abstract
The power switching noise caused by rapid charging and discharging has always been an issue in PDN (Power Delivery Network) design. This noise would not only deteriorate the stability of the power profile, it would also couple to signal transition via if the power via is placed nearby, resulting in deterioration of the overall system signal integrity. Therefore, the relative placement between power via and signal transition via is very important in board design. The relationship between effects of power-signal coupling and distance will be addressed in this paper and will be validated with both simulation results and measurement results from a real-case board design.