A study on packaging design of SiC power module using near-field magnetic scanning techniques

Abstract

This report focuses the current distribution in a module identifiedwith magnetic near-field intensity for optimizing layout and packaging design of silicon carbide (SiC) power module. This measurement methodology can visualize the practical current distribution on a wiring pattern in a module and can estimate the effect of snubber capacitor in a DC-link of half-bridge to suppress the voltage overshoot and ringing oscillation.