Analysis for complex power distribution networks considering densely populated vias

Young-Seok Hong, Heeseok Lee, Joon-Ho Choi, Moon-Hyun Yoo, J. Kong
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引用次数: 6

Abstract

Due to the high speed and low power trends, the power distribution network (PDN) in multilayer printed circuit boards (PCBs) plays a pivotal role in terms of system performance. The paper presents an efficient analysis method for the irregularly shaped power/ground plane pair considering the effect of densely populated power/ground and signal vias in the frequency domain. The plane is divided based on geometric properties and modeled by the parallel-plate transmission line theory. For examination of various via effects, we have modeled vias according to their properties, such as power, ground and signal. Using a conventional circuit simulator, the input- and trans-impedance of power/ground planes are investigated. Since the proposed method is accurate as well as fast, it can be efficiently applied to multilayered PCB structures at the early design stage.
考虑密集过孔的复杂配电网分析
由于高速低功耗的发展趋势,多层印刷电路板(pcb)中的配电网络(PDN)在系统性能方面起着举足轻重的作用。本文提出了一种在频域考虑了密集的电源/地孔和信号过孔的影响下,对不规则形状的电源/地面对进行有效分析的方法。平面根据几何性质划分,采用平行板传输线理论建模。为了检验各种通孔效应,我们根据通孔的性质,如功率、接地和信号,建立了模型。利用传统的电路模拟器,研究了电源/地平面的输入阻抗和反阻抗。由于该方法准确、快速,可以有效地应用于多层PCB结构的早期设计。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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