Sub-50NM InGaAs/InAlAs/InP HEMT for sub-millimeter wave power amplifier applications

X. Mei, V. Radisic, W. Deal, W. Yoshida, J. Lee, L. Dang, P. Liu, W. Liu, M. Lange, J. Zhou, J. Uyeda, K. Leong, R. Lai
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引用次数: 5

Abstract

An InGaAs/InAlAs/InP HEMT with sub-50nm EBL gate has been developed for sub-millimeter wave (SMMW) power amplifier (PA) applications. In this paper, we report the device performance including high drain current, high gain, high breakdown voltage and scalability to large gate periphery, which are essential for achieving high output power at these frequencies. Excellent yield, process uniformity and repeatability are also demonstrated, which is critical for power amplifiers employing large number of devices and gate fingers. 10mW output power is demonstrated from a fixtured 338 GHz PA module.
用于亚毫米波功率放大器的50nm以下InGaAs/InAlAs/InP HEMT
针对亚毫米波(SMMW)功率放大器(PA)的应用,开发了一种具有低于50nm EBL栅极的InGaAs/InAlAs/InP HEMT。在本文中,我们报告了器件的性能,包括高漏极电流,高增益,高击穿电压和可扩展性到大栅极外围,这是在这些频率下实现高输出功率所必需的。优异的良率,工艺均匀性和可重复性也被证明,这对于采用大量器件和门指的功率放大器至关重要。从固定的338 GHz PA模块演示10mW输出功率。
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