Reflow soldering evaluation of lead free solder alloys

Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) Pub Date : 1993-06-01 DOI:10.1109/ECTC.1993.346729

C. Melton

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引用次数: 7

Abstract

A quantitative dynamic solder wettability measurement was used to evaluate the effects of reflow processing on the wettability parameters associated with the nonlead bearing solders 96.5% Sn/3.5% Ag and 58% Bi/42% Sn. An experimental design approach employing full factorial experiments was formulated to investigate the solder wetting dependence of the reflow parameters, atmosphere, peak reflow temperature, time above liquidus, and metallization. Solder wettability was determined with respect to the final degree of spread and the extent of solder wetting onto the lands of surface mount components. The solder alloy composition of 96.5% Sn/3.5% Ag was found to exhibit better wetting characteristics than the 58% Bi/42% Sn alloy. This wetting behavior was enhanced under the reflow conditions of a nitrogen atmosphere and the use of a gold metallization. The wetting of the conventional 63% Sn/37% Pb solder alloy was improved over the comparatively processed 58% Bi/42% Sn alloy. However, the 63% Sn/37% Pb solder alloy displayed a greater sensitivity to reflow atmosphere than the 96.5% Sn/3.5% Ag alloy, which generally exhibited better wetting characteristics than the Sn/Pb alloy.<>

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无铅焊料合金的回流焊评价

采用定量动态焊料润湿性测量方法，评价了回流处理对96.5% Sn/3.5% Ag和58% Bi/42% Sn无铅钎料润湿性参数的影响。采用全因子实验设计方法研究了回流参数、气氛、峰值回流温度、高于液相线时间和金属化对钎料润湿的影响。焊锡润湿性是根据焊锡在表面贴装元件表面上的最终扩散程度和润湿程度来确定的。96.5% Sn/3.5% Ag钎料合金的润湿性能优于58% Bi/42% Sn钎料合金。这种润湿行为在氮气气氛回流条件下和金金属化的使用下得到了增强。与经过加工的58% Bi/42% Sn合金相比，传统的63% Sn/37% Pb钎料合金的润湿性得到了改善。然而，63% Sn/37% Pb钎料合金对回流气氛的敏感性高于96.5% Sn/3.5% Ag钎料合金，后者总体上表现出比Sn/Pb合金更好的润湿特性

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Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93)

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