Compact metamaterial antenna array for long term evolution (LTE) handset application

Norberto Lopez, Cheng-Jung Lee, A. Gummalla, M. Achour
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引用次数: 41

Abstract

In the digital world, Moore's Law states the number of transistors on Integrated Circuits (ICs) has been doubling every two years since 1965. While these ICs occupy only 10% of the wireless communication device area, the remaining 90%, referred to as RF Front-End Model (FEM), consists of a collection of discrete passive and active components such as antennas, filters, diplexer, duplexers, couplers, power combiner/splitter, and power amplifiers. While these powerful ICs enable effective implementation of Multiple Input Multiple Output (MIMO) digital processing, the main issue of MIMO RF FEM implementation in small devices such as handsets still remains unsolved. Without such a full solution, network providers cannot deploy next generation wireless broadband networks, such as 3GPP Long Term Evolution (LTE) networks, that can sustain tens of Mbps throughput with mobility. This paper addresses this specific problem by presenting an LTE MIMO air interface solution for handsets using metamaterial designs, which offer small, low-cost, and low-profile antennas printed directly on PCB for easy integration and simple manufacturing - all critical factors for rapid deployment and commercial success. The proposed metamaterial MIMO array consists of dual resonance antennas occupying λ0/10 × λ0/41 × λ0/387 volume at center frequency 771MHz of the LTE band 746–796MHz. The performances of two antenna array configurations with spacing of λ0/13 and λ0/5 are studied while quantifying its near-filed and far-field channel correlation.
用于长期演进(LTE)手机应用的紧凑型超材料天线阵列
在数字世界中,摩尔定律指出,自1965年以来,集成电路(ic)上的晶体管数量每两年翻一番。虽然这些集成电路仅占无线通信设备领域的10%,但其余90%称为射频前端模型(FEM),由一系列分立的无源和有源组件组成,如天线、滤波器、双工器、双工器、耦合器、功率合成器/分频器和功率放大器。虽然这些功能强大的集成电路能够有效地实现多输入多输出(MIMO)数字处理,但在手机等小型设备中实现MIMO RF FEM的主要问题仍未解决。如果没有这样一个完整的解决方案,网络提供商就无法部署下一代无线宽带网络,例如3GPP长期演进(LTE)网络,这些网络可以在移动性方面维持数十Mbps的吞吐量。本文通过提出一种用于使用超材料设计的手机的LTE MIMO空中接口解决方案来解决这一特定问题,该解决方案提供直接印刷在PCB上的小型,低成本和低调天线,易于集成和简单制造-所有这些都是快速部署和商业成功的关键因素。所提出的超材料MIMO阵列由双谐振天线组成,在LTE频段746-796MHz的中心频率771MHz处占据λ0/10 × λ0/41 × λ0/387体积。研究了λ0/13和λ0/5两种间距天线阵列的性能,并对其近场和远场信道相关性进行了量化。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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