Correlations Between Simulation and Electromagnetic Properties Testing of Hot Melt Nanostructured Adhesives

2018 International Conference and Exposition on Electrical And Power Engineering (EPE) Pub Date : 2018-10-01 DOI:10.1109/ICEPE.2018.8559821

G. Ursan, Maria Ursan, A. D. L. Rosa, Iulian Cosmin Contofan

引用次数: 0

Abstract

The paper presents aspects related to the simulation of electromagnetic properties in the case of the development of hot melt nanostructured adhesives, and the correlation of these simulations with the results of the preliminary tests performed.

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本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

2018 International Conference and Exposition on Electrical And Power Engineering (EPE)

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