Experimental characterization of in-package microfluidic cooling on a System-on-Chip

Abstract

This paper, for the first time, experimentally demonstrated the in-package microfluidic cooling on a commercial System-on-Chip (SoC). The pinfin interposer attached to the commercial SoC achieved energy efficient cooling for the SPLASH-2 benchmark suite in measurement. The low-power piezoelectric pump controlled by the SoC ensures the thermal integrity and reduces the system-level energy consumption through leakage reduction. The measurements demonstrated that the in-package fluidic cooling improves the SoC's energy-efficiency and reduces design footprint compared to the external passive cooling.