I. Mehr, D. Paterson, N. Abaskharoun, J. Lloyd, H. L'Bahy, A. DeSimone
{"title":"An integrated mixed-signal front-end for broadband modems","authors":"I. Mehr, D. Paterson, N. Abaskharoun, J. Lloyd, H. L'Bahy, A. DeSimone","doi":"10.1109/VLSIC.2002.1015038","DOIUrl":null,"url":null,"abstract":"An integrated mixed-signal transceiver for broadband communications is presented. The transceiver includes a configurable dual/single receive data path, a configurable dual/single transmit data path, and auxiliary functions including low-speed ADCs, low-speed DACs, serial port interface, clock and reference generation blocks. The receive data path provides constant input impedance and contains dual input buffers, dual programmable gain stages (PGAs), dual 12-bit ADC blocks, and a digital processing block, all sampling at up to 64 MHz. The transmit data path contains a digital processing block as well, and dual 14-bit DAC blocks with programmable gain, sampling at up to 128 MHz. The chip was implemented in double-poly triple-metal 0.35 /spl mu/m CMOS technology.","PeriodicalId":162493,"journal":{"name":"2002 Symposium on VLSI Circuits. Digest of Technical Papers (Cat. No.02CH37302)","volume":"15 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2002-06-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2002 Symposium on VLSI Circuits. Digest of Technical Papers (Cat. No.02CH37302)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/VLSIC.2002.1015038","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
Abstract
An integrated mixed-signal transceiver for broadband communications is presented. The transceiver includes a configurable dual/single receive data path, a configurable dual/single transmit data path, and auxiliary functions including low-speed ADCs, low-speed DACs, serial port interface, clock and reference generation blocks. The receive data path provides constant input impedance and contains dual input buffers, dual programmable gain stages (PGAs), dual 12-bit ADC blocks, and a digital processing block, all sampling at up to 64 MHz. The transmit data path contains a digital processing block as well, and dual 14-bit DAC blocks with programmable gain, sampling at up to 128 MHz. The chip was implemented in double-poly triple-metal 0.35 /spl mu/m CMOS technology.