Benchmarking semiconductor manufacturing

R. Leachman, D. Hodges
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引用次数: 2

Abstract

We are studying the manufacturing performance of semiconductor wafer fabrication plants in the US, Asia, and Europe. There are great similarities in production equipment, manufacturing processes, and products produced at semiconductor fabs around the world. However, detailed comparisons over multi-year intervals show that important quantitative indicators of productivity, including defect density (yield), major equipment production rates, wafer throughput time, and effective new process introduction to manufacturing, vary by factors of 3 to as much as 5 across an international sample of 28 fabs. We conduct on-site observations, and interviews with manufacturing personnel at all levels from operator to general manager, to better understand reasons for the observed wide variations in performance. We have identified important factors in the areas of information systems, organizational practices, process and technology improvements, and production control that correlate strongly with high productivity. Optimum manufacturing strategy is different for commodity products, high-value proprietary products, and foundry business.
对标半导体制造
我们正在研究美国、亚洲和欧洲的半导体晶圆制造厂的制造性能。世界各地的半导体工厂在生产设备、制造工艺和产品上都有很大的相似之处。然而,多年间隔的详细比较表明,生产力的重要定量指标,包括缺陷密度(良率),主要设备生产率,晶圆吞吐量时间,以及有效的新工艺引入制造,在28个晶圆厂的国际样本中变化了3到5个因素。我们进行现场观察,并与从操作员到总经理的各级制造人员进行访谈,以更好地了解所观察到的性能差异的原因。我们已经确定了信息系统、组织实践、过程和技术改进以及与高生产率密切相关的生产控制等领域的重要因素。商品产品、高价值专有产品和代工企业的最优制造策略是不同的。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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